Microcantilevers encapsulated in fluid wells for sensing in liquids

High-efficiency silicon photodiode detector for sub-keV electron microscopy

Enhancing the wettability of high aspect-ratio through-silicon vias lined with LPCVD silicon nitride of PE-ALD titanium nitride for void-free bottom-up copper electroplating

Solid-state backscattered-electron detector for sub-keV imaging in scanning electron microscopy

Patterned growth of carbon nanotubes for vertical interconnects in 3D integrated circuits

Versatile silicon photodiode detector technology for scanning electron microscopy with high-efficiency sub-5 keV electron detection

Thermal analysis of peptides with a calorimeterchip

Thermal characterization of microliter amounts of liquids by a micromachined calorimetric transducer

Two-Dimensional Fiber Positioning and Clamping Device for Product-Internal Microassembly

Design rules for Patterning in Deep Cavities Formed by TMAH-etching of Si

Reduction of surface roughness of a silicon chip for advanced nanocalorimetry

Front to back-side 3D interconnects fabrication process based on controlled cu electroplating of high aspect ratio through silicon vias (HAR-TSVs)

Improvement of wettability of silicon nitride in PECVD environment for copper electrodeposition in HAR vias

Integrated microcantilevers for mechanical detection of biomolecules

Local Sealing of High Aspect Ratio Vias for Single Step Bottom-up Copper Electroplating of Through Wafer Interconnects

Bulk-Micromachined Test Structure for Fast and Reliable Determination of the Lateral Thermal Conductivity of Thin Films

Copper electroplating for 3D interconnects

MEMS test structure for measuring thermal conductivity of thin films

Microcantilevers inside nanoliter wells

Microcantilevers inside nanoliter wells