Copper electroplating for 3D interconnects

Saadaoui, M; Wien, W.H.A.; van Zeijl, H.W.; Sarro, Pasqualina M

Copper electroplating for 3D interconnects

Conference paper (2006)

Authors

M Saadaoui Old - EWI Sect. ECTM

W.H.A. Wien Electronic Components, Technology and Materials -

H.W. van Zeijl Electronic Components, Technology and Materials -

Pasqualina M Sarro Electronic Components, Technology and Materials -

Research Group

Old - EWI Sect. ECTM

Elektrotechniek Techniek

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Published Date

2006

Language

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Research Group

Old - EWI Sect. ECTM