Enhancing the wettability of high aspect-ratio through-silicon vias lined with LPCVD silicon nitride of PE-ALD titanium nitride for void-free bottom-up copper electroplating

Journal article (2011)

Authors

M Saadaoui Electronic Components, Technology and Materials

H van Zeijl External organisation

W.H.A. Wien Electronic Components, Technology and Materials

HTM Pham Electronic Components, Technology and Materials

C. Kwakernaak OLD Surface and Interface Engineering

HCM Knoops External organisation

Wilhelmus M.M. Kessels External organisation

RMCM van de Sanden External organisation

FC Voogt External organisation

F Roozeboom External organisation

P. M. Sarro Electronic Components, Technology and Materials

Research Group

Electronic Components, Technology and Materials

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Published Date

2011

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Research Group

Electronic Components, Technology and Materials

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