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Enhancing the wettability of high aspect-ratio through-silicon vias lined with LPCVD silicon nitride of PE-ALD titanium nitride for void-free bottom-up copper electroplating

Journal article (2011)

Authors

M Saadaoui Electronic Components, Technology and Materials
H van Zeijl External organisation
W.H.A. Wien Electronic Components, Technology and Materials
HTM Pham Electronic Components, Technology and Materials
C. Kwakernaak OLD Surface and Interface Engineering
HCM Knoops External organisation
Wilhelmus M.M. Kessels External organisation
RMCM van de Sanden External organisation
FC Voogt External organisation
F Roozeboom External organisation
P. M. Sarro Electronic Components, Technology and Materials
Research Group
Electronic Components, Technology and Materials
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Published Date

2011

Language

Undefined/Unknown

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Research Group

Electronic Components, Technology and Materials

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