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HCM Knoops

Journal article (1)

1 records found

1

Enhancing the wettability of high aspect-ratio through-silicon vias lined with LPCVD silicon nitride of PE-ALD titanium nitride for void-free bottom-up copper electroplating

Journal article (2011) - M Saadaoui (author), H van Zeijl (author), Pasqualina M Sarro (author), W.H.A. Wien (author), HTM Pham (author), C. Kwakernaak (author), HCM Knoops (author), WMM Kessels (author), RMCM van de Sanden (author), FC Voogt (author), F Roozeboom (author)