HCM Knoops

Journal article (1)

1 records found

Enhancing the wettability of high aspect-ratio through-silicon vias lined with LPCVD silicon nitride of PE-ALD titanium nitride for void-free bottom-up copper electroplating

Journal article (2011) - M Saadaoui (author) , H van Zeijl (author) , P. M. Sarro (author) , W.H.A. Wien (author) , HTM Pham (author) , C. Kwakernaak (author) , HCM Knoops (author) , Wilhelmus M.M. Kessels (author) , RMCM van de Sanden (author) , FC Voogt (author) , F Roozeboom (author)