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HCM Knoops
1 records found
1
Authored
Enhancing the wettability of high aspect-ratio through-silicon vias lined with LPCVD silicon nitride of PE-ALD titanium nitride for void-free bottom-up copper electroplating
Journal article (2011) -
M Saadaoui
,
H van Zeijl
,
Pasqualina M Sarro
,
W.H.A. Wien
,
HTM Pham
,
C. Kwakernaak
,
HCM Knoops
,
W. M.M. Kessels
,
RMCM van de Sanden
,
FC Voogt
,
F Roozeboom
