Front to back-side 3D interconnects fabrication process based on controlled cu electroplating of high aspect ratio through silicon vias (HAR-TSVs)

Saadaoui, M; Wien, W.H.A.; van Zeijl, H.W.; Schellevis, H.; Laros, M; Sarro, Pasqualina M

Front to back-side 3D interconnects fabrication process based on controlled cu electroplating of high aspect ratio through silicon vias (HAR-TSVs)

Conference paper (2008)

Authors

M Saadaoui Old - EWI Sect. ECTM

W.H.A. Wien Electronic Components, Technology and Materials -

H.W. van Zeijl Electronic Components, Technology and Materials -

H. Schellevis Electronic Components, Technology and Materials -

M Laros Electronic Components, Technology and Materials -

Pasqualina M Sarro Electronic Components, Technology and Materials -

Research Group

Old - EWI Sect. ECTM

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Published Date

2008

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Research Group

Old - EWI Sect. ECTM