Front to back-side 3D interconnects fabrication process based on controlled cu electroplating of high aspect ratio through silicon vias (HAR-TSVs)

Saadaoui, M; Wien, W.H.A.; Zeijl, HW; Schellevis, H.; Laros, M; Sarro, P.M.

Front to back-side 3D interconnects fabrication process based on controlled cu electroplating of high aspect ratio through silicon vias (HAR-TSVs)

Conference paper (2008)

Authors

M Saadaoui Old - EWI Sect. ECTM

W.H.A. Wien Electronic Components, Technology and Materials

HW Zeijl Electronic Components, Technology and Materials

H. Schellevis Electronic Components, Technology and Materials

M Laros Electronic Components, Technology and Materials

P.M. Sarro Electronic Components, Technology and Materials

Research Group

Old - EWI Sect. ECTM

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Published Date

2008

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Research Group

Old - EWI Sect. ECTM

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