Improvement of wettability of silicon nitride in PECVD environment for copper electrodeposition in HAR vias

Conference paper (2007)

Authors

M Saadaoui Old - EWI Sect. ECTM
W.H.A. Wien Electronic Components, Technology and Materials
H.W. Zeijl Electronic Components, Technology and Materials
A. van den Bogaard Electronic Components, Technology and Materials
PM Sarro Electronic Components, Technology and Materials
Research Group
Old - EWI Sect. ECTM
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Published Date

2007

Language

Undefined/Unknown

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Research Group

Old - EWI Sect. ECTM

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