Improvement of wettability of silicon nitride in PECVD environment for copper electrodeposition in HAR vias

Saadaoui, M; Wien, W.H.A.; van Zeijl, H.W.; van den Bogaard, A.; Sarro, Pasqualina M

Improvement of wettability of silicon nitride in PECVD environment for copper electrodeposition in HAR vias

Conference paper (2007)

Authors

M Saadaoui Old - EWI Sect. ECTM

W.H.A. Wien Electronic Components, Technology and Materials -

H.W. van Zeijl Electronic Components, Technology and Materials -

A. van den Bogaard Electronic Components, Technology and Materials -

Pasqualina M Sarro Electronic Components, Technology and Materials -

Research Group

Old - EWI Sect. ECTM

To reference this document use:

http://resolver.tudelft.nl/uuid:6fc1a38e-64b8-4f19-9646-d617f00b182c

More Info

expand_more

Published Date

2007

Language

Undefined/Unknown

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Research Group

Old - EWI Sect. ECTM