WD van Driel | TU Delft Repository

Wv

WD van Driel

Conference paper (20)

Journal article (6)

26 records found

1

Establishment of the mesoscale parameters for epoxy-copper interfacial separation

Conference paper (2012) - K.Y. Wong (author), SYY Leung (author), René H. Poelma (author), K.M.B. Jansen (author), CCA Yuan (author), WD van Driel (author), Kouchi Zhang (author)

Advanced structural similarity rules for the BGA package family

Conference paper (2005) - WD van Driel (author), A. Mavinkurve (author), MAJ van Gils (author), GQ Zhang (author), DG Yang (author), L.J. Ernst (author)

Prediction of thermo-mechanical integrity of wafer backend processes

Journal article (2004) - V Gonda (author), JMJ den Toonder (author), J Beijer (author), GQ Zhang (author), WD van Driel (author), ROJM Hoofman (author), L.J. Ernst (author)

Virtual prototyping and qualification of Board Level Assembly

Conference paper (2004) - WD van Driel (author), GQ Zhang (author), JWC de Vries (author), M Jansen (author), L.J. Ernst (author)

Effect of metal layout design on passivation crack occurrence using both experimental and simulation techniques

Conference paper (2004) - RBR van Silfhout (author), WD van Driel (author), Yaocheng Li (author), MAJ van Gils (author), JHJ Jansen (author), GQ Zhang (author), G Tao (author), J Bisschop (author), L.J. Ernst (author)

On wire failures in micro-electronic packages

Conference paper (2004) - WD van Driel (author), JHJ Jansen (author), RBR van Silfhout (author), MAJ van Gils (author), GQ Zhang (author), L.J. Ernst (author)

Modeling of cure-induced warpage of plastic IC packages

Conference paper (2004) - D Yang (author), K.M.B. Jansen (author), L.J. Ernst (author), GQ Zhang (author), WD van Driel (author), HJL Bressers (author)

Fully cure-dependent polymer modeling and application to QFN-packages warpage

Conference paper (2004) - D Yang (author), L.J. Ernst (author), K.M.B. Jansen (author), C van t Hof (author), GQ Zhang (author), WD van Driel (author), HJL Bressers (author)

Virtual qualification of moisture induced failures of advanced packages

Conference paper (2004) - MAJ van Gils (author), WD van Driel (author), GQ Zhang (author), HJL Bressers (author), RBR van Silfhout (author), XJ Fan (author), JHJ Jansen (author)

Prediction of crack growth in IC passivation layers

Journal article (2004) - Y He (author), MAJ van Gils (author), WD van Driel (author), GQ Zhang (author), RBR van Silfhout (author), L.J. Ernst (author)

Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods

Journal article (2004) - WD van Driel (author), C Liu (author), GQ Zhang (author), JHJ Janssen (author), RBR van Silfhout (author), MAJ van Gils (author), L.J. Ernst (author)

Prediction of process-induced warpage of IC packages encapsulated with thermosetting polymers

Conference paper (2004) - D Yang (author), K.M.B. Jansen (author), L.J. Ernst (author), GQ Zhang (author), WD van Driel (author), HJL Bressers (author), XJ Fan (author)

Mechanism-based delamination prediction during reflow with moisture preconditioning

Conference paper (2004) - X Fan (author), GQ Zhang (author), WD van Driel (author), L.J. Ernst (author)

From chemical building blocks of polymers to microelectronics reliability

Conference paper (2004) - HJL Bressers (author), WD van Driel (author), K.M.B. Jansen (author), L.J. Ernst (author), GQ Zhang (author)

The influence of leadframe on passivation cracks growth

Conference paper (2003) - GQ Zhang (author), WD van Driel (author), XJ Fan (author), L.J. Ernst (author)

Cracking prediction of IC's passivation layer using J-integral

Conference paper (2003) - GQ Zhang (author), WD van Driel (author), XJ Fan (author), L.J. Ernst (author)

Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods

Conference paper (2003) - C Liu (author), GQ Zhang (author), WD van Driel (author), RBR van Silfhout (author), MAJ van Gils (author), L.J. Ernst (author)

Packaging induced die stresses - effect of chip anisotropy and time-dependent behavior of a molding compound

Journal article (2003) - WD van Driel (author), JHJ Janssen (author), GQ Zhang (author), L.J. Ernst (author), DG Yang (author)

Prediction and verification of process induced warpage of electronic packages

Journal article (2003) - WD van Driel (author), GQ Zhang (author), JHJ Janssen (author), L.J. Ernst (author), F Su (author), KS Chian (author), S Yi (author)

Prediction of crack growth in IC passivation layers

Conference paper (2003) - Y He (author), GQ Zhang (author), MAJ van Gils (author), RBR van Silfhout (author), WD van Driel (author), L.J. Ernst (author)