D

D Yang

40 records found

An autonomous capacitive sensor system for high accuracy and stability position measurement, such as required in high-precision industrial equipment, is presented. The system incorporates a self-alignment funcion based on a thermal stepping motor and a built-in capacitive referen ...
Wafer Level Packages are one of the most advanced packaging concepts. It combines the advantages of flip chip with conventional surface mount technologies. In recent years, we have seen a tremendous growth in the application of Wafer Level Packages, both in quantities as well as ...
In this paper the temperature effects on the effective Young's modulus of [110] silicon cantilevers is analyzed and measured in the range of 25-100°C. The quasi-static pull-in instability method developed recently for ultra-thin cantilevers [H. Sadeghian, C.K. Yang, J.F.L. Goosen ...
In this paper, the Copper wirebonding technology is investigated. From a numerical point of view, the wirebonding process is modelled. Experiments on specially designed bondpads are performed in order to verify the models. As such, this leads to a thorough understanding of the wi ...
In this paper, virtual prototyping is used to generate more accurate and efficient stress design rules for IC backend structures, in combination with packaging processes and geometry. The addressed failure mode is passivation cracks and depending on the package type or family thi ...
Transferring molding process is widely used in the plastic IC packaging. Die cracking failures due to transfer molding process may occur. In this paper, an investigation on the die fracture and its failure probability is conducted. The approaches and results of die strength chara ...
This paper presents our effort to predict reliability problems for MEMS packages. MEMS devices are vulnerable to the external loads subjected to it. As such, MEMS devices need to be protected. Capping the device can generate protections: a piece of silicon is placed on top of it ...
This paper presents our effort to predict reliability problems for MEMS packages. MEMS devices are vulnerable to the external loads subjected to it. As such, MEMS devices need to be protected. Protections can be generated by capping the device: a piece of silicon is placed on top ...
In the electronics industry epoxy molding compounds, underfills and adhesives are used for the packaging of electronic components. These materials are applied in liquid form, cured at elevated temperatures and then cooled down to room temperature. During these processing steps re ...
Warpage is a critical issue for QFN array molding process. In this paper, a cure-dependent viscoelastic constitutive model is established to model the cure-induced warpage in array molding process. For the relaxation modulus functions of the packaging polymer , the equilibrium mo ...
Package warpage, interface delamination and thermal fatigue are the major reliability concerns for micro-electronic packages, caused by mismatch in thermal expansion together with residual stress originating from the curing process of the packaging polymers. To investigate the in ...