Effect of Package Type in IC-Package Stress Interaction Design Rules

Conference paper (2008)

Authors

W.D. van Driel Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
D Yang Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
Kouchi Zhang Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
Research Group
Dynamics of Micro and Nano Systems (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2008

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Dynamics of Micro and Nano Systems

Abstract

In this paper, virtual prototyping is used to generate more accurate and efficient stress design rules for IC backend structures, in combination with packaging processes and geometry. The addressed failure mode is passivation cracks and depending on the package type or family this failure mode is easier to occur. A series of experiments are conducted to prove the effect of the package type on this IC failure mode. It is demonstrated that for successful development of IC backend structures and processes, it is essential to take into account the influence of the package in the earlier phase of IC backend development. The so-called integral design rules, accounting for all the major loading sources and history of the complete product creation process has to be used for the development of new generation semiconductors devices.