Currently, the use of electronic components for automotive and aerospace applications is developing quickly. More and more components will be exposed to harsh environments, such as high temperature and high moisture. In general, this high temperature is always above the glass transition temperature (Tg) of the encapsulation material, being Epoxy Molding Compound (EMC). EMC exposed to high temperature could induce reliability problems of components due to changes of its material properties accompanied with volume shrinkage. Therefore, the characterization and modelling of the aging process in EMCs during high-temperature conditions has become an important issue. In our previous work [1], the characterization methods to obtain the material properties as function of aging time were discussed and introduced. The present work focuses on a new and efficient method to model the impact of the aging process of EMCs on the warpage and the stress state of a package using FEM simulation. Here, an “equivalent layer” model, which includes a fully oxidized layer and an unaged core, is applied to simplify the modelling of the thermal aging effects. The current thickness of the “equivalent oxidized layer” is obtained by combining the experimental results and numerical analyses of properly chosen samples. At the end of the paper the aging shrinkage is estimated by using the equivalent thickness concept

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This investigation highlights the rationale of adhesive bonding of atmospheric pressure plasma treated high temperature resistant polymeric sheet such as polyimide sheet (Meldin 7001), with titanium sheets. The surface of polyimide (PI) sheet was treated with atmospheric pressure plasma for different exposure times. The surface energy was found to increase with increase in exposure time. However, longer exposure time of plasma, results in deterioration of the surface layer of PI resulting in degradation and embrittlement.

Contact angle measurements with sessile drop technique were carried out for estimation of surface energy. SEM (EDS) and AFM analyses of treated and untreated specimens were carried out to examine the surface characteristics and understanding morphological changes following surface treatment. Untreated samples and atmospheric pressure plasma treated samples of polyimide Meldin 7001 sheet were bonded together as well as with titanium substrates to form overlap joints. Single lap shear tensile testing of these adhesively bonded joints was performed to measure bond strength and to investigate the effect of surface treatment on adhesive bond strength. An optimized plasma treatment time results in maximum adhesive bond strength and consequently, this technology is highly acceptable for aviation and space applications.
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It is well known that epoxy moulding compound (EMC) plays an important role in the reliability of electronic packages. In order to predict the mechanical behaviour of electronic packages that are encapsulated with moulding compound, the material properties of EMCs should be carefully characterized and modelled. Currently, more and more components are exposed to severe environments. Among these, high temperature conditions can lead to irreversible changes in EMCs. These changes can be attributed to chemical processes such as oxidation and can lead to degradation of the applied resins, which we refer to here as aging. As a result, the thermo-mechanical properties of the EMCs change severely with time. Due to ongoing changes in the aging EMC of a package, the stress and strain distributions in the package change with time, while embrittlement affects the fracture strength. As a consequence, the long-term reliability of a package is severely affected. Since an appropriate constitutive representation of the material properties of the slowly growing oxidation layers is not available, it is cumbersome to predict the reliability of real packages for long term applications. Being motivated by this limitation, in the present work, we focus on the experimental characterization as well as on the numerical modelling of aging of EMCs at high temperature storage (HTS). As a result the long term stress-strain distribution of a package can be simulated.@en

The high temperature resistant polymers and metal composites are used widely in aviation, space, automotive and electronics industry. The high temperature resistant polymers and metals are joined together using high temperature adhesives. Polyimide and epoxy adhesives that can withstand high temperature (200 °C-300 °C) are commonly used for joining high temperature metals and polymers. The performance of adhesively bonded metals and polymers depends upon physical properties of these high temperature adhesives. The physical properties like modulus, Tg. coefficient of thermal expansion (CTE) etc., are affected by external factors such as force, temperature, humidity etc. The external factors play a vital role in the adhesive bond strength and the durability of bond between metal and polymer. In this investigation moisture absorption analysis of polyimide adhesive is performed using Q5000 moisture absorption analyzer. The moisture absorption data of polyimide at different temperatures and humidity level is obtained. Further, the moisture absorption data is fitted to well known Fickian-fit model to determine the diffusion coefficient (D) and saturated moisture gain Msat. Diffusion coefficient (D) and Msat of polyimide and epoxy adhesive are calculated at different temperature and different humidity level. It is observed that diffusion coefficient changes with the change in temperature and humidity level. The diffusion coefficient (D) and M sat data are used in Fick¿s second law of diffusion to estimate the time needed for preconditioning of the adhesively bonded titanium samples in humidity chamber at elevated temperature and higher moisture level. After preconditioning of adhesively bonded Titanium samples in moisture chamber for estimated time, samples will be subjected to lap shear tensile test to study the effect of these elevated conditions on adhesive bond strength.@en

Warpage of flat packages is partly due to chemical shrinkage of the molding compound during cure and partly due to differences in thermal contraction in the subsequent cooling stage. The latter effect is relatively easy to incorporate in numerical simulations but the cureinduced shrinkage effect is not and is therefore often neglected in warpage simulations. Recent validation studies however showed that it is essential that both effects are taken into account. In this paper we develop explicit analytical expressions for the cure-induced residual stresses and warpage of a simple bilayer construction. We do this by assuming that curing always takes place above the molding compounds glass transition temperature such that the material is in its rubbery state and that viscoelastic effects are absent. The analytical warpage model was shown to give results comparable to numerical calculations using a fullly cure dependent viscoelastic material model. Furthermore, for the first time accurate analytical expression for the Stress Free Temperature and Stress Free Strain are obtained. With these expressions the effect of cure shrinkage on residual stresses can easily be incorporated in existing (numerical) stress analyses without the need of using extensive cure dependent viscoelastic material models.@en