D. K. Vu
5 records found
1
Authored
In this paper we propose a new multistep characterisation method to be able to map out the dependency of moisture diffusion parameters of a polymeric material over a range of temperature and humidity conditions in a limited amount of time. We do that by (1) using a moisture so ...
In microelectronic packages, generally the chip is encapsulated by a molding compound (MC). The MC provides a mechanical support for the chip and isolates it from the environment and as a result protects the encapsulated chip. It is well known that MC's are polymer-based mater ...
In semiconductor technologies thermally and electrically conductive adhesives are widely used to attach the die to the substrate. Focus of this work are Isotropic Conductive Adhesives (ICA) with a high amount of electrically conductive filler particles and the characterization ...
Currently, the use of electronic components for automotive and aerospace applications is developing quickly. More and more components will be exposed to harsh environments, such as high temperature and high moisture. In general, this high temperature is always above the glass ...