B Michel | TU Delft Repository

Characterization of epoxy based highly filled die attach materials in microelectronics

Conference paper (2017) - I Maus (author), C. Liebl (author), M Fink (author), D. K. Vu (author), M. Hartung (author), H Preu (author), K.M.B. Jansen (author), B Michel (author), B Wunderle (author), B Wunderle (author), L. Weiss (author)

In semiconductor technologies thermally and electrically conductive adhesives are widely used to attach the die to the substrate. Focus of this work are Isotropic Conductive Adhesives (ICA) with a high amount of electrically conductive filler particles and the characterization of ...

Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization- difficulties and solution

Conference paper (2014) - I Maus (author), H Preu (author), M Niessner (author), H Nabi (author), K.M.B. Jansen (author), R Pantou (author), L. Weiss (author), B Michel (author), B Wunderle (author)

Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip

Conference paper (2014) - F Rost (author), F Schindler-Saefkow (author), A.R. Rezaie Adli (author), K.M.B. Jansen (author), B Wunderle (author), J Keller (author), S Rzepka (author), B Michel (author)

Challenges of viscoelastic characterization of low Tg epoxy based adhesives for automotive applications in DMA and relaxation experiments

Conference paper (2014) - I Maus (author), H Preu (author), M Niessner (author), M Fink (author), K.M.B. Jansen (author), R Pantou (author), B Michel (author), B Wunderle (author)

Material parameter identification by combination of stress chip measurements and FE-simulation in MERGE

Conference paper (2014) - F Rost (author), F Schindler-Saefkow (author), D Vogel (author), A.R. Rezaie Adli (author), K.M.B. Jansen (author), S Rzepka (author), B Michel (author), J Schaufuß (author), A Tsapkolenko (author), P Nossol (author)