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H Nabi
Academic Work (1)
Conference paper (1)
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Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization- difficulties and solution
Conference paper (2014) -
I Maus (author)
,
H Preu (author)
,
M Niessner (author)
,
H Nabi (author)
,
K.M.B. Jansen (author)
,
R Pantou (author)
,
L. Weiss (author)
,
B Michel (author)
,
B Wunderle (author)