Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization- difficulties and solution

Conference paper (2014)

Authors

I Maus External organisation
H. Preu External organisation
M Niessner External organisation
H Nabi External organisation
K.M.B. Jansen OLD Product Engineering
R Pantou External organisation
Laurens Weiss External organisation
B. Michel External organisation
B Wunderle External organisation
Research Group
OLD Product Engineering
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Published Date

2014

Language

English

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Research Group

OLD Product Engineering