IM

I Maus

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In semiconductor technologies thermally and electrically conductive adhesives are widely used to attach the die to the substrate. Focus of this work are Isotropic Conductive Adhesives (ICA) with a high amount of electrically conductive filler particles and the characterization of ...
The rapid diversification in microelectronics forebodes more complex system integration, be it for denser function integration or a span of dimensions between various technologies. Products may include more features, perform faster and be cheaper. With these trends the amount of ...