Characterization of epoxy based highly filled die attach materials in microelectronics

Conference paper (2017)

Authors

I Maus Infineon Technologies AG

C. Liebl Infineon Technologies AG

M Fink Infineon Technologies AG

D. K. Vu Infineon Technologies AG

M. Hartung Infineon Technologies AG

H Preu Infineon Technologies AG

K.M.B. Jansen Emerging Materials -

B Michel Fraunhofer ENAS

B Wunderle Technische Universität Chemnitz, Fraunhofer ENAS

L. Weiss Infineon Technologies AG

Research Group

Emerging Materials () (TU Delft)

Material properties Microassembly Temperature measurement Curing Temperature distribution Heating Systems

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http://resolver.tudelft.nl/uuid:a2c85dd7-e773-4eb9-ad99-e9dbb75d0ae0

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Published Date

2017

Language

English

Reuse Rights

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Faculty

Industrial Design Engineering

Department

Sustainable Design Engineering

Research Group

Emerging Materials

Abstract

In semiconductor technologies thermally and electrically conductive adhesives are widely used to attach the die to the substrate. Focus of this work are Isotropic Conductive Adhesives (ICA) with a high amount of electrically conductive filler particles and the characterization of such materials.

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