Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip

Rost, F; Schindler-Saefkow, F; Rezaie Adli, A.R.; Jansen, Kaspar M B; Wunderle, B; Keller, J; Rzepka, S; Michel, B.

Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip

Conference paper (2014)

Authors

F Rost External organisation

F Schindler-Saefkow External organisation

A.R. Rezaie Adli OLD Product Engineering

Kaspar M B Jansen OLD Product Engineering

B Wunderle External organisation

J Keller External organisation

S Rzepka External organisation

B. Michel External organisation

Research Group

OLD Product Engineering

To reference this document use:

http://resolver.tudelft.nl/uuid:d14af45b-d2ba-414a-b541-6cb011d58676

More Info

expand_more

Published Date

2014

Language

English

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Research Group

OLD Product Engineering

No files available

Metadata only record. There are no files for this conference paper.