Fully Cure-Dependent Modelling and Characterization of EMC's with Application to Package Warpage Simulation

Conference paper (2006)

Authors

L.J. Ernst Computational Design and Mechanics
Kaspar Jansen Computational Design and Mechanics
MK Saraswat Computational Design and Mechanics
Guo-Qi Zhang Computational Design and Mechanics
D Yang Dynamics of Micro and Nano Systems
C van t Hof Dynamics of Micro and Nano Systems
HJL Bressers External organisation
Research Group
Computational Design and Mechanics
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Published Date

2006

Language

Undefined/Unknown

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Research Group

Computational Design and Mechanics

Abstract

Package warpage, interface delamination and thermal fatigue are the major reliability concerns for micro-electronic packages, caused by mismatch in thermal expansion together with residual stress originating from the curing process of the packaging polymers. To investigate the influence of the residual stress- and strain fields on the failure predictions and to optimise the product for reliability, cure-dependent viscoelastic constitutive relations for the applied polymers are required. The present paper gives an overview of recent progress in establishing such relations.
A model moulding compound is used for cure dependent characterization and is subsequently used for QFN package moulding. The modelled and the experimentally obtained warpage have been compared.

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