Experimental and numerical investigation on warpage of QFN packages induced during the array molding process

Yang, D; Jansen, K.M.B.; Ernst, L.J.; Zhang, GQ; Beijer, J.G.J.; Janssen, JHJ

Experimental and numerical investigation on warpage of QFN packages induced during the array molding process

Conference paper (2005)

Authors

D Yang Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering

K.M.B. Jansen Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering

L.J. Ernst Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering

GQ Zhang External organisation

J.G.J. Beijer External organisation

JHJ Janssen External organisation

Research Group

Dynamics of Micro and Nano Systems (Mechanical, Maritime and Materials Engineering) (TU Delft)

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Published Date

2005

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Dynamics of Micro and Nano Systems