GZ

GQ Zhang

97 records found

Authored

Finite thickness influence on spherical and conical indentation on viscoelastic thin polymer film
Conference paper (2003) - V Gonda, Jaap Den Toonder, J Beijer, GQ Zhang, L.J. Ernst

The influence of leadframe on passivation cracks growth
Conference paper (2003) - GQ Zhang, WD van Driel, XJ Fan, L.J. Ernst

Effect of delamination of IC/compound interface on passivation cracking

Micromechanical modeling of stress evolution induced during cure in a particle-filled electronic packaging polymer
Conference paper (2003) - D Yang, K.M.B. Jansen, L Wang, L.J. Ernst, GQ Zhang, HJL Bressers

Warpage-based optimization of the curing profile for electronic packaging polymers
Conference paper (2003) - DG Yang, K.M.B. Jansen, QY Li, JS Liang, L.J. Ernst, GQ Zhang

Investigation on flip chip solder joint fatigue with cure-dependent underfill properties

Response surface modeling for nonlinear packaging stresses
Journal article (2003) - WD van Driel, GQ Zhang, JHJ Janssen, L.J. Ernst

Recent developments in thermal mechanical modeling of the curing process of filled thermoset polymers

The effect of interface models on the interface stresses between a thin oxide layer and a substrate
Conference paper (2002) - YT He, GQ Zhang, L.J. Ernst

The state-of-the-art of thermo-mechanical characterisation of thin polymer films

On the effect of cure-residual stress on flip chip failure prediction

Parameter sensitivity study of cure-dependent underfill properties on flip chip failures
Conference paper (2002) - D Yang, GQ Zhang, W van Driel, J Janssen, HJL Bressers, L.J. Ernst

Prediction and verification of process-induced thermal deformation of electronic packages using non-linear FEM and 3D interferometry
Conference paper (2002) - WD van Driel, GQ Zhang, J Janssen, L.J. Ernst, F Su, S Yi

Mechanical modeling and characterization of the curing process of underfill materials

Improvement of material characterization of curing polymers by image processing
Conference paper (2002) - V Gonda, C Liu, C van t Hof, L.J. Ernst, GQ Zhang

Prediction of back-end process-induced wafer warpage and experimental verification
Conference paper (2002) - RBR van Silfhout, WD van Driel, Y Li, GQ Zhang, L.J. Ernst

A micro-mechanics approach for polymeric material failures in microelectronic packaging
Conference paper (2002) - XJ Fan, GQ Zhang, L.J. Ernst

Solders fatigue prediction using interfacial boundary volume criterion
Conference paper (2002) - XJ Zhao, GQ Zhang, JFJM Caers, L.J. Ernst

On the constitutive modeling of thermosetting polymers for assembly process simulations

Trends in virtual thermo-mechanical prototyping of microelectronics - the challenges for applied mechanics professionals
Conference paper (2001) - L.J. Ernst, GQ Zhang