Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems

Santagata, F.; Farriciello, C.; Fiorentino, G.; van Zeijl, H.W.; Silvestri, C.; Zhang, GQ; Sarro, Pasqualina M

Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems

Journal article (2013)

Authors

F. Santagata Electronic Components, Technology and Materials -

C. Farriciello Electronics -

G. Fiorentino Electronic Components, Technology and Materials -

H.W. van Zeijl Electronic Components, Technology and Materials -

C. Silvestri Electronic Components, Technology and Materials -

GQ Zhang External organisation

Pasqualina M Sarro Electronic Components, Technology and Materials -

Research Group

Electronic Components, Technology and Materials () (TU Delft)

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http://resolver.tudelft.nl/uuid:b0fcab07-201b-424f-9f7e-564ec0a1f8ab

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Published Date

2013

Language

English

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials