Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems

Santagata, Fabio; Fiorentino, G.; Nie, M.; Farriciello, C.; Poelma, René H.; Zhang, GQ; Sarro, Lina

Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems

Conference paper (2012)

Authors

Fabio Santagata Electronic Components, Technology and Materials

G. Fiorentino Electronic Components, Technology and Materials

M. Nie Electronic Components, Technology and Materials

C. Farriciello Electronics

René H. Poelma Electronic Components, Technology and Materials

GQ Zhang External organisation

Lina Sarro Electronic Components, Technology and Materials

Research Group

Electronic Components, Technology and Materials

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Published Date

2012

Language

English

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Research Group

Electronic Components, Technology and Materials

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