AS

A Saxena

1 records found

Semi empirical low cycle fatigue crack growth analysis of nanostructure chip-to-package copper interconnect using molecular simulation
Book chapter (2012) - Sau Koh (author), S.W. Koh (author), Sau Wee Koh (author), SW Koh (author), A Saxena (author), Willem D. van Driel (author), Willem D. Driel (author), Willem D. Van Driel (author), Willem Dirk van van Driel (author), Willem Dirk van Driel (author), Willem Dirk van Van Driel (author), W.D. van Driel (author), W.D. Driel (author), W.D. Van Driel (author), Willem D.Van van Driel (author), Willem D.Van Driel (author), Willem D.Van Van Driel (author), WD van Driel (author), WD Driel (author), WD Van Driel (author), W. D. van van Driel (author), W. D. van Driel (author), W. D. van Van Driel (author), Willem van Driel (author), Willem Driel (author), Willem Van Driel (author), Williem van Driel (author), Williem Driel (author), Williem Van Driel (author), Willem Dirk van Driel (author), Willem Dirk Driel (author), Willem Dirk Van Driel (author), W. van Driel (author), W. Driel (author), W. Van Driel (author), W.D. van van Driel (author), W.D. van Driel (author), W.D. van Van Driel (author), Willem Dirk van Driel (author), Willem Dirk Driel (author), Willem Dirk Van Driel (author), W. D. van Driel (author), W. D. Driel (author), W. D. Van Driel (author), GQ Zhang (author), R Tummala (author)