Wire bonding the future: a combined experimental and numerical approach to improve the Cu-wire bonding quality

Conference paper (2010)

Authors

E Spaan External organisation
E Ooms External organisation
W.D. van Driel Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
C.A. Yuan Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
D Yang Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
GQ Zhang External organisation
Research Group
Computational Design and Mechanics (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2010

Language

English

Reuse Rights

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Computational Design and Mechanics

Abstract

In this paper, the Copper wirebonding technology is investigated. From a numerical point of view, the wirebonding process is modelled. Experiments on specially designed bondpads are performed in order to verify the models. As such, this leads to a thorough understanding of the wirebonding process, especially the forces that take a role during this process.