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SY
S Yi
Academic Work (2)
Conference paper (1)
Journal article (1)
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2 records found
1
Prediction and verification of process induced warpage of electronic packages
Journal article (2003) -
WD van Driel (author)
,
GQ Zhang (author)
,
JHJ Janssen (author)
,
L.J. Ernst (author)
,
F Su (author)
,
KS Chian (author)
,
S Yi (author)
Prediction and verification of process-induced thermal deformation of electronic packages using non-linear FEM and 3D interferometry
Conference paper (2002) -
WD van Driel (author)
,
GQ Zhang (author)
,
J Janssen (author)
,
L.J. Ernst (author)
,
F Su (author)
,
S Yi (author)
