Prediction and verification of process-induced thermal deformation of electronic packages using non-linear FEM and 3D interferometry

van Driel, WD; Zhang, GQ; Janssen, J; Ernst, L.J.; Su, F; Yi, S

Prediction and verification of process-induced thermal deformation of electronic packages using non-linear FEM and 3D interferometry

Conference paper (2002)

Authors

WD van Driel External organisation

GQ Zhang External organisation

J Janssen External organisation

L.J. Ernst Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering

F Su External organisation

S Yi External organisation

Research Group

Dynamics of Micro and Nano Systems (Mechanical, Maritime and Materials Engineering) (TU Delft)

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Published Date

2002

Language

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Dynamics of Micro and Nano Systems