WD van Driel | TU Delft Repository

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WD van Driel

Conference paper (20)

Journal article (6)

26 records found

1

Establishment of the mesoscale parameters for epoxy-copper interfacial separation

Conference paper (2012) - K.Y. Wong (author), SYY Leung (author), René H. Poelma (author), K.M.B. Jansen (author), CCA Yuan (author), WD van Driel (author), Kouchi Zhang (author)

Advanced structural similarity rules for the BGA package family

Conference paper (2005) - WD van Driel (author), A Mavinkurve (author), MAJ van Gils (author), GQ Zhang (author), DG Yang (author), L.J. Ernst (author)

Virtual qualification of moisture induced failures of advanced packages

Conference paper (2004) - MAJ van Gils (author), WD van Driel (author), GQ Zhang (author), HJL Bressers (author), RBR van Silfhout (author), XJ Fan (author), JHJ Jansen (author)

Virtual prototyping and qualification of Board Level Assembly

Conference paper (2004) - WD van Driel (author), GQ Zhang (author), JWC de Vries (author), M. Jansen (author), L.J. Ernst (author)

Modeling of cure-induced warpage of plastic IC packages

Conference paper (2004) - D Yang (author), K.M.B. Jansen (author), L.J. Ernst (author), GQ Zhang (author), WD van Driel (author), HJL Bressers (author)

Prediction of thermo-mechanical integrity of wafer backend processes

Journal article (2004) - V Gonda (author), JMJ den Toonder (author), J Beijer (author), GQ Zhang (author), WD van Driel (author), ROJM Hoofman (author), L.J. Ernst (author)

Prediction of crack growth in IC passivation layers

Journal article (2004) - Y He (author), MAJ van Gils (author), WD van Driel (author), GQ Zhang (author), RBR van Silfhout (author), L.J. Ernst (author)

Mechanism-based delamination prediction during reflow with moisture preconditioning

Conference paper (2004) - X Fan (author), GQ Zhang (author), WD van Driel (author), L.J. Ernst (author)

Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods

Journal article (2004) - WD van Driel (author), C Liu (author), GQ Zhang (author), JHJ Janssen (author), RBR van Silfhout (author), MAJ van Gils (author), L.J. Ernst (author)

From chemical building blocks of polymers to microelectronics reliability

Conference paper (2004) - HJL Bressers (author), WD van Driel (author), K.M.B. Jansen (author), L.J. Ernst (author), GQ Zhang (author)

On wire failures in micro-electronic packages

Conference paper (2004) - WD van Driel (author), JHJ Jansen (author), RBR van Silfhout (author), MAJ van Gils (author), GQ Zhang (author), L.J. Ernst (author)

Prediction of process-induced warpage of IC packages encapsulated with thermosetting polymers

Conference paper (2004) - D Yang (author), K.M.B. Jansen (author), L.J. Ernst (author), GQ Zhang (author), WD van Driel (author), HJL Bressers (author), XJ Fan (author)

Effect of metal layout design on passivation crack occurrence using both experimental and simulation techniques

Conference paper (2004) - RBR van Silfhout (author), WD van Driel (author), Y. Li (author), MAJ van Gils (author), JHJ Jansen (author), GQ Zhang (author), G Tao (author), J Bisschop (author), L.J. Ernst (author)

Fully cure-dependent polymer modeling and application to QFN-packages warpage

Conference paper (2004) - D Yang (author), L.J. Ernst (author), K.M.B. Jansen (author), C van t Hof (author), GQ Zhang (author), WD van Driel (author), HJL Bressers (author)

Prediction of crack growth in IC passivation layers

Conference paper (2003) - Y He (author), GQ Zhang (author), MAJ van Gils (author), RBR van Silfhout (author), WD van Driel (author), L.J. Ernst (author)

Cracking prediction of IC's passivation layer using J-integral

Conference paper (2003) - GQ Zhang (author), WD van Driel (author), XJ Fan (author), L.J. Ernst (author)

Packaging induced die stresses - effect of chip anisotropy and time-dependent behavior of a molding compound

Journal article (2003) - WD van Driel (author), JHJ Janssen (author), GQ Zhang (author), L.J. Ernst (author), DG Yang (author)

Influence of material combinations on delamination failures in a cavity down TBGA package

Conference paper (2003) - WD van Driel (author), G. Wisse (author), AYL Chang (author), GQ Zhang (author), L.J. Ernst (author)

The influence of leadframe on passivation cracks growth

Conference paper (2003) - GQ Zhang (author), WD van Driel (author), XJ Fan (author), L.J. Ernst (author)

Effect of delamination of IC/compound interface on passivation cracking

Conference paper (2003) - RBR van Silfhout (author), JD Roustant (author), WD van Driel (author), Y. Li (author), GQ Zhang (author), D Yang (author)