DY
DG Yang
28 records found
1
In this paper, the interaction between chip and package is investigated. A series of experiments are conducted to investigate the effect of the package type on occurrence of passivation cracks in IC structures. Virtual prototyping is used to generate more accurate and efficient s
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In order to calculate cure induced stresses, reliable material data is needed over a large modulus range. This paper concerns the derivation of correction equations needed for the interpretation of dynamic mechanical experiments on two different shear tools. For the first shear t
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In order to establish the possible influence of residual stress and strain fields after cure on the failure prediction of electronic packages, cure-dependent viscoelastic constitutive relations for the applied polymers are required. This paper gives an overview of progress in the
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Laminate-based and Silicon-based SiP approaches for RF modules are described. Laminate-based SiP approach is the mostly used one in the integration of RF modules. Failure modes, such as delamination, via cracking, excessive substrate deformation and cracking, were observed during
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Flexible end-products like banking cards and wearable electronics are about to pervade our lives massively. Due to the fact that flexibility is a must, reliability problems are expected due to the mechanical handling loading conditions the end-product is subjected to. This paper
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Nowadays, one of the trends of micrelectronic packaging is to integrate multiple funcional systems into one package, resulting in more applications of multi-materials in the form of laminated thin films or stacks. As a consequence, the number of interfaces increases. This causes
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