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JFJM Caers
Academic Work (2)
Conference paper (1)
Journal article (1)
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2 records found
1
Investigation on flip chip solder joint fatigue with cure-dependent underfill properties
Journal article (2003) -
DG Yang (author)
,
GQ Zhang (author)
,
L.J. Ernst (author)
,
C van t Hof (author)
,
JFJM Caers (author)
,
HJL Bressers (author)
,
JHJ Janssen (author)
Solders fatigue prediction using interfacial boundary volume criterion
Conference paper (2002) -
XJ Zhao (author)
,
GQ Zhang (author)
,
JFJM Caers (author)
,
L.J. Ernst (author)
