Investigation on flip chip solder joint fatigue with cure-dependent underfill properties

Yang, DG; Zhang, GQ; Ernst, L.J.; van t Hof, C; Caers, JFJM; Bressers, HJL; Janssen, JHJ

Investigation on flip chip solder joint fatigue with cure-dependent underfill properties

Journal article (2003)

Authors

DG Yang External organisation

GQ Zhang External organisation

L.J. Ernst Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering

C van t Hof Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering

JFJM Caers External organisation

HJL Bressers External organisation

JHJ Janssen External organisation

Research Group

Dynamics of Micro and Nano Systems (Mechanical, Maritime and Materials Engineering) (TU Delft)

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Published Date

2003

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Dynamics of Micro and Nano Systems