Fully Cure-Dependent Modeling and Characterization of EMC's with Application to Package Warpage Simulation

Conference paper (2006)

Authors

L.J. Ernst Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
K.M.B. Jansen Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
MK Saraswat Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
C van t Hof Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
Kouchi Zhang Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
DG Yang External organisation
HJL Bressers External organisation
Research Group
Computational Design and Mechanics (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2006

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Computational Design and Mechanics

Abstract

In order to establish the possible influence of residual stress and strain fields after cure on the failure prediction of electronic packages, cure-dependent viscoelastic constitutive relations for the applied polymers are required. This paper gives an overview of progress in the field of viscoelastic modeling and characterization of applied polymers over the past few years. It also discusses limitations and needs for future development.