Laminate-based and Silicon-based SiP approaches for RF modules are described. Laminate-based SiP approach is the mostly used one in the integration of RF modules. Failure modes, such as delamination, via cracking, excessive substrate deformation and cracking, were observed during the major packaging processes and the qualification tests with a Moisture Sensitivity Level 3 followed with a lead-free reflow profile. Experimental and virtual thermo-mechanical prototyping methodology is implemented to investigate the root cause of the failures. Advanced modeling approach is applied to model the integrated thermo-mechanical and moisture-related stress and strains.@en