Prediction and verification of process induced warpage of electronic packages

Journal article (2003)

Authors

WD van Driel External organisation
GQ Zhang External organisation
JHJ Janssen External organisation
L.J. Ernst Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
F Su External organisation
KS Chian External organisation
S Yi External organisation
Research Group
Dynamics of Micro and Nano Systems (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2003

Language

Undefined/Unknown

Reuse Rights

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Dynamics of Micro and Nano Systems