Prediction of process-induced warpage of IC packages encapsulated with thermosetting polymers

Conference paper (2004)

Authors

D Yang Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
K.M.B. Jansen Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
L.J. Ernst Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
GQ Zhang External organisation
WD van Driel External organisation
HJL Bressers External organisation
XJ Fan External organisation
Research Group
Dynamics of Micro and Nano Systems (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2004

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Dynamics of Micro and Nano Systems