JF Jongste | TU Delft Repository

JJ

JF Jongste

Conference paper (10)

Journal article (7)

Report (7)

24 records found

1

Deformation Mechanism in the Forcefill Process.

Journal article (2000) - G.C.A.M. Janssen (author), GCAM Janssen (author), JF Jongste (author), A.H. Verbruggen (author)

Localized stress near and the thermal expansion of AI 2 Cu precipitates in an AI thin film matrix.

Journal article (2000) - JP Lokker (author), NM van der Pers (author), N.M. van der Pers (author), A.H. Verbruggen (author), GCAM Janssen (author), G.C.A.M. Janssen (author), JF Jongste (author), S Radelaar (author)

Influence of SiH2Cl2 on the kinetics of chemical vapor deposition of tungsten by SiH4 reduction of WF6.

Journal article (1999) - JF Jongste (author), TGM Oosterlaken (author), G.C.A.M. Janssen (author), GCAM Janssen (author), S Radelaar (author)

Kinetcs of copper forcefill.

Conference paper (1999) - G.C.A.M. Janssen (author), GCAM Janssen (author), JF Jongste (author), S Radelaar (author)

Mechanism for forcefill.

Conference paper (1999) - GCAM Janssen (author), G.C.A.M. Janssen (author), A.H. Verbruggen (author), JF Jongste (author), S Radelaar (author)

Kinetics of Copper Forcefill.

Conference paper (1998) - GCAM Janssen (author), G.C.A.M. Janssen (author), JF Jongste (author), S Radelaar (author), T.W. de Loos (author), Theo W. de Loos (author), ThW de Loos (author), T Kouno (author), T Ohba (author)

Report of cleaning of the water after contact to the pressurizing medium and Report on the integrity of reviously defined circuits to the prevalent temperature and pressure in liquid mediated forcefill

Report (1998) - JF Jongste (author), G.C.A.M. Janssen (author), GCAM Janssen (author), S Radelaar (author)

Report on kinetics of forcefill and relation between in-plane stress and forcefill capability

Report (1998) - JF Jongste (author), G.C.A.M. Janssen (author), GCAM Janssen (author), S Radelaar (author)

The role of the TiN liner in forcefill.

Journal article (1998) - GCAM Janssen (author), G.C.A.M. Janssen (author), JF Jongste (author), A.H. Verbruggen (author), S Radelaar (author)

High Pressure Filling of Sub-micron Aluminium Vias

Conference paper (1998) - JF Jongste (author), JP Lokker (author), G.C.A.M. Janssen (author), GCAM Janssen (author), A.H. Verbruggen (author), S Radelaar (author)

Aluminium via fill at elevated pressure and teperature

Conference paper (1998) - G.C.A.M. Janssen (author), GCAM Janssen (author), JF Jongste (author), JP Lokker (author), A.H. Verbruggen (author), S Radelaar (author)

Reactive Ion Etchin of metal stack consisting of an aluminium ally, WGe barrier and Ti adhesion layer

Journal article (1997) - E Sabouret (author), C Schaffnit (author), JF Jongste (author), G.C.A.M. Janssen (author), GCAM Janssen (author), S Radelaar (author)

High Pressure Aluminium Via-Fill for ULSI interconnect using a Liquid Transducer

Conference paper (1997) - JF Jongste (author), X Li (author), X. Li (author), JP Lokker (author), GCAM Janssen (author), G.C.A.M. Janssen (author), S Radelaar (author), T.W. de Loos (author), Theo W. de Loos (author), ThW de Loos (author)

High Pressure Aluminium for Submicron Vias using a Liquid Transducer

Journal article (1997) - JF Jongste (author), X. Li (author), X Li (author), JP Lokker (author), G.C.A.M. Janssen (author), GCAM Janssen (author), S Radelaar (author)

Report on stress relaxation at constant temperatures in AlNiCr contiguous films and stacks of films

Report (1997) - JP Lokker (author), JF Jongste (author), GCAM Janssen (author), G.C.A.M. Janssen (author), S Radelaar (author)

Mechanical Reliability of CVD-Copper Thin Films

Journal article (1997) - JF Jongste (author), JP Lokker (author), GCAM Janssen (author), G.C.A.M. Janssen (author), S Radelaar (author), J Torres (author), J Palleau (author)

Stress in AlNiCr films and stacks of films

Conference paper (1997) - JP Lokker (author), JF Jongste (author), DJ de Boer (author), G.C.A.M. Janssen (author), GCAM Janssen (author), S Radelaar (author)

Electrical properties of WGex contacts on Ti adhesion layers

Conference paper (1996) - PFM Verhoeven (author), TGM Oosterflaken (author), JF Jongste (author), O Demolliens (author), GCAM Janssen (author), G.C.A.M. Janssen (author), S Radelaar (author)

Isothermal stress relaxation in Al, AlCu and AlVPd films

Conference paper (1996) - JP Lokker (author), JF Jongste (author), GCAM Janssen (author), G.C.A.M. Janssen (author), S Radelaar (author)

Aluminium Sub-micron Via-Fill using a high Pressure Liquid Transducer

Report (1996) - JF Jongste (author), X Li (author), X. Li (author), JP Lokker (author), GCAM Janssen (author), G.C.A.M. Janssen (author), S Radelaar (author), T.W. de Loos (author), Theo W. de Loos (author), ThW de Loos (author)