Localized stress near and the thermal expansion of AI 2 Cu precipitates in an AI thin film matrix.

Lokker, JP; van der Pers, N.M.; Verbruggen, A.H.; Janssen, G.C.A.M.; Jongste, JF; Radelaar, S

Localized stress near and the thermal expansion of AI 2 Cu precipitates in an AI thin film matrix.

Journal article (2000)

Authors

JP Lokker QN/Fysics of NanoElectronics

N.M. van der Pers OLD Virtual Materials and Mechanics

A.H. Verbruggen QN/Fysics of NanoElectronics

G.C.A.M. Janssen OLD Metals Processing, Microstructures and Properties

JF Jongste External organisation

S Radelaar OLD Metals Processing, Microstructures and Properties

Research Group

QN/Fysics of NanoElectronics

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Published Date

2000

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Research Group

QN/Fysics of NanoElectronics