AV

A.H. Verbruggen

43 records found

Authored

Stress relaxation and creep in free-standing thin aluminium films studied using a bulge tester.
Conference paper (1999) - AJ Kalkman, A.H. Verbruggen, G.C.A.M. Janssen

l/f noise in mono- and polycrystalline aluminium

High Pressure Filling of Sub-micron Aluminium Vias

Electromigration and diffusion in short Al-Ni-Cr lines
Conference paper (1998) - LC Jacobs, A.H. Verbruggen, AJ Kalkman, S Radelaar

Aluminium via fill at elevated pressure and teperature

The role of the TiN liner in forcefill.

Resistance Changes Induced by the Formation of a Single Void/Hillock During Electromigration

Electromigration and l/f noise in single-crystalline, bamboo and polycrystalline Al lines

Comparison of electromigration and stress-voiding properties of submicron Al-Cu (1 at% Cu) and AlNiCr (0.1 at% Ni, o.1 at%Cr) interconnect lines

Fabricaton of submicron single-crystalline and bamboo Al lines by recrystallization

Electromigration in short Al lines studied by high-resolution resistance measurement

Chemical vs. Physical factors in dry etching induced damage in the Si/GexSi1-x system

Kinetics of Cu segregation in AlCu (1%) submicron interconnects studied by resistance measurements
Conference paper (1997) - AJ Kalkman, G.C.A.M. Janssen, A.H. Verbruggen, S Radelaar

Electromigration and 1/f noise in single-crystalline, bamboo and polycrystalline Al lines

1/f noise and microsructure in thin aluminium lines

Current dependence of reversible electromigration induced resistance changes in short Al lines and interpretation of irreversible effects

Single-crystalline and bamboo Al lines fabricated by graphoepitaxy

Characterization of single-crystalline Al films grown on Si(111)

Stress-voiding and Relaxation in single level thermally aged Al Alloys

Report on electromigration- and stress migration properties of AlSi VPd alloys