Multiprobe resistance monitoring of Blech pattern during electromigration testing.

Shingubara, S; Osaka, T; Sakaue, H; Takahagi, T; Verbruggen, A.H.

Multiprobe resistance monitoring of Blech pattern during electromigration testing.

Conference paper (1999)

Authors

S Shingubara External organisation

T Osaka External organisation

H Sakaue External organisation

T Takahagi External organisation

A.H. Verbruggen QN/Fysics of NanoElectronics

Research Group

QN/Fysics of NanoElectronics

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Published Date

1999

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Research Group

QN/Fysics of NanoElectronics