High Pressure Filling of Sub-micron Aluminium Vias

Jongste, JF; Lokker, JP; Janssen, G.C.A.M.; Verbruggen, A.H.; Radelaar, S

High Pressure Filling of Sub-micron Aluminium Vias

Conference paper (1998)

Authors

JF Jongste External organisation

JP Lokker QN/Fysics of NanoElectronics

G.C.A.M. Janssen OLD Metals Processing, Microstructures and Properties

A.H. Verbruggen QN/Fysics of NanoElectronics

S Radelaar OLD Metals Processing, Microstructures and Properties

Research Group

QN/Fysics of NanoElectronics

To reference this document use:

http://resolver.tudelft.nl/uuid:43ba7684-2cd0-4272-b6a5-d52ba627db8a

More Info

expand_more

Published Date

1998

Language

Undefined/Unknown

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Research Group

QN/Fysics of NanoElectronics