VR

V. Rajaraman

41 records found

MEMS integration techniques on silicon-on-insulator for inertial devices

Below-IC post-CMOS integration of thick MEMS on a thin-SOI platform using embedded interconnects

Method of monolithically integrating MEMS/NEMS sensors/actuators with MEMS/NEMS sensors/actuators and example semiconductor process for making the same
Artefact (2011) - V. Rajaraman (author)

Design, modelling and fabrication of a 40-330 Hz dual-mass MEMS gyroscope on thick-SOI technology

A novel soi-mems ¿micro-swing¿ time-accelerometer operating in two time-based transduction modes for high sensitivity and extended range

PECVD silicon carbide surface micriomachining technology and selected MEMS applications

Two types of silicon biomimetics MEMS gyroscopes

Preliminary design and modeling of high performance tunable, decoupled MEMS gyroscope

Qualification of MEMS gyroscope architectures for high performance and tunability

Design and modelling of a three mass, decoupled, tunable SOI MEMS gyroscope with sense frame architecture

Design and modelling of a decoupled, tunable SOI-MEMS gyroscope

Silicon carbide thin film encapsulation of planar thermo- electric infrared detectors for an IR microspectrometer

A piezoresistive detector design for a high sensitivity pull in time digital accelerometer

Design and modeling of a three mass, decoupled, tunable SOI-MEMS gyroscope with sense frame architecture

Design and modeling of a flexible contact mode piezoresistive detector for time based acceleration sensing

A piezoresistive detector design for a high sensitivity time based digital accelerometer

Pull in time based acceleration sensing

Design and modelling of a three mass, decoupled, tunable SOI MEMS gyroscope with sense frame architecture

A versatile CMOS compatible PECVD silicon carbide MEMS technology

Wafer-level PECVD sic micropackaging technology for MEMS devices