Below-IC post-CMOS integration of thick MEMS on a thin-SOI platform using embedded interconnects

Rajaraman, V.; Koning, JJ; Ooms, E; Pandraud, G.; Makinwa, K.A.A.; Boezen, H

Below-IC post-CMOS integration of thick MEMS on a thin-SOI platform using embedded interconnects

Conference paper (2012)

Authors

V. Rajaraman Electronic Instrumentation - , Electronic Components, Technology and Materials -

JJ Koning External organisation

E Ooms External organisation

G. Pandraud Electronic Components, Technology and Materials -

K.A.A. Makinwa Electronic Instrumentation -

H Boezen External organisation

Research Group

Electronic Components, Technology and Materials () (TU Delft)

To reference this document use:

http://resolver.tudelft.nl/uuid:afa4ba5d-9e97-4f2d-9417-860486c9492b

More Info

expand_more

Published Date

2012

Language

English

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials