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H Boezen
Academic Work (1)
Conference paper (1)
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Below-IC post-CMOS integration of thick MEMS on a thin-SOI platform using embedded interconnects
Conference paper (2012) -
V. Rajaraman (author)
,
V. Rajaraman (author)
,
JJ Koning (author)
,
E Ooms (author)
,
G. Pandraud (author)
,
K.A.A. Makinwa (author)
,
H Boezen (author)
