Climate change resistant coastline by biological in-situ reinforcement of sand

Deep reactive ion etching in through-silicon via technology

Control of the ion-distribution and measurement of ion currents with a non-sinusoidal substrate bias

Dry etching of SiC in inductively coupled Cl-2/Ar plasma

Deep anisotropic dry etching of silicon microstructures by high-density plasmas

The etching of silicon carbide in inductively coupled SF6/O-2 plasma

IC-compatible processing of inertial sensors using SF6-O2 cryogenic plasma process

Modeling of fluorine-based high-density plasma etching of anisotropic silicon trenches with oxygen sidewall passivation

Processing of inertial sensors using SF6-O2 Cryogenic plasma process

Advanced time-multiplexed plasma etching of high aspect ratio silicon structures

Single step cryogenic SF6/O2 plasma etching process for the development of inertial devices

Temperature influence on etching deep holes with SF6/O2 cryogenic plasma

Single step cryogenic SF6/O2 plasma etching process for the development of a novel quad gyroscope

High aspect ratio cryogenic etching of silicon with SF6/O2 plasma

Limitations and complementary value of cryogenic SF6-O2 and Bosch plasma etch process for silicon micromachining.

Limitations and complementary value of cryogenic SF6-O2 and Bosch plasma etch process for silicon micromachining

Temperature influence on etching deep holes with SF6/O2 cryogenic plasma

Aspect ratio and crystallographic orientation dependence in deep dry silicon etching at cryogenic temperatures

Temperature influence on etching deep holes with SF6/O2 cryogenic plasma.

High aspect ratio cyrogenic etching of Silicon with SF6/O2 plasma.