Though-wafer copper electropating for 3-D interconnects

High aspect ratio cryogenic etching of silicon with SF6/O2 plasma

Through-wafer copper electroplating for 3-D interconnects

Temperature influence on etching deep holes with SF6/O2 cryogenic plasma

Trough-wafer copper plugs formation for 3-Dimensional ICs

Limitations and complementary value of cryogenic SF6-O2 and Bosch plasma etch process for silicon micromachining

Aspect ratio and crystallographic orientation dependence in deep dry silicon etching at cryogenic temperatures

Through-wafer copper plugs formation for 3-dimensional ICs