Through-wafer copper electroplating for 3-D interconnects

Nguyen, NT; Boellaard, E; Pham, HMT; Kiutchoukov, VG; Cracium, G; Sarro, Pasqualina M

Through-wafer copper electroplating for 3-D interconnects

Conference paper (2001)

Authors

NT Nguyen Electronic Components, Technology and Materials -

E Boellaard Electronic Components, Technology and Materials -

HMT Pham External organisation

VG Kiutchoukov External organisation

G Cracium External organisation

Pasqualina M Sarro Electronic Components, Technology and Materials -

Research Group

Electronic Components, Technology and Materials () (TU Delft)

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Published Date

2001

Language

Undefined/Unknown

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials