VK

VG Kiutchoukov

18 records found

Patterning of polyimide and metal in deep trenches

New fabrication technology for wafer-through hole interconnects

Through-wafer copper plugs formation for 3-dimensional ICs

Novel wafer-through technique for interconnects

Forming rounded convex corner by using two-step anisotropic koh wet etching

Trough-wafer copper plugs formation for 3-Dimensional ICs

Though-wafer copper electropating for 3-D interconnects

Through-wafer copper electroplating for 3-D interconnects

Etching behavior of KOH at the convex corner

Electrochemical deposition of copper in thin layers on planar surface [Russische tekst]

New photoresist coating method for 3-D structured wafers

Coating of deep anisotropically etched grooves with polymide and photoresist

Patterning of polyimide and metal in deep grooves

Novel method for spinning of photoresist on wafers with through-holes

Uniform photoresist coating of anisotropically etched cavities in silicon

Rounding of wafer - hole corners in -oriented silicon wafer by anisotropic etching

Possibilities for application of electrochemical deposition of Cu for hole and channel filling in Si substrates

Novel method for spinning of photoresist on wafers with through-holes