VK

VG Kiutchoukov

18 records found

Forming rounded convex corner by using two-step anisotropic koh wet etching

Patterning of polyimide and metal in deep trenches

Novel wafer-through technique for interconnects

Trough-wafer copper plugs formation for 3-Dimensional ICs

Through-wafer copper electroplating for 3-D interconnects

Though-wafer copper electropating for 3-D interconnects

Through-wafer copper plugs formation for 3-dimensional ICs

New fabrication technology for wafer-through hole interconnects

Etching behavior of KOH at the convex corner

Electrochemical deposition of copper in thin layers on planar surface [Russische tekst]

Coating of deep anisotropically etched grooves with polymide and photoresist

New photoresist coating method for 3-D structured wafers

Patterning of polyimide and metal in deep grooves

Possibilities for application of electrochemical deposition of Cu for hole and channel filling in Si substrates

Rounding of wafer - hole corners in -oriented silicon wafer by anisotropic etching

Novel method for spinning of photoresist on wafers with through-holes

Novel method for spinning of photoresist on wafers with through-holes

Uniform photoresist coating of anisotropically etched cavities in silicon