Though-wafer copper electropating for 3-D interconnects

Nguyen, NT; Boellaard, E; Pham, PN; Kiutchoukov, VG; Cracium, G; Sarro, Pasqualina M

Though-wafer copper electropating for 3-D interconnects

Conference paper (2001)

Authors

NT Nguyen Electronic Components, Technology and Materials -

E Boellaard Electronic Components, Technology and Materials -

PN Pham Electronic Components, Technology and Materials -

VG Kiutchoukov External organisation

G Cracium External organisation

Pasqualina M Sarro Electronic Components, Technology and Materials -

Research Group

Electronic Components, Technology and Materials () (TU Delft)

To reference this document use:

http://resolver.tudelft.nl/uuid:1909bd55-ba56-4595-a97b-ec1c70d34dd0

More Info

expand_more

Published Date

2001

Language

Undefined/Unknown

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials