Rounding of wafer - hole corners in -oriented silicon wafer by anisotropic etching

Conference paper (1999)

Authors

VG Kiutchoukov External organisation
J.R. Mollinger Electronic Instrumentation - EEMCS
A. Bossche Electronic Instrumentation - EEMCS
Research Group
Electronic Instrumentation (EEMCS) (TU Delft)
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Published Date

1999

Language

Undefined/Unknown

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Instrumentation