S

S Sosin

19 records found

Interconnect schemes for stretchable array-type microsystems
Doctoral thesis (2011) - S Sosin (author)

Large-area silicon electronics using stretchable metal interconnect

Stretchable silicon electronics

Free-standing, parylene-sealed copper interconnect for stretchable silicon electronics
In this paper, development and characterization of a free-standing electroplated copper interconnect for applications in flexible and stretchable electronics is presented. The copper layer with typical thickness of 5 µm is plated into a photoresist mould realizing meander and mes ...

Process technology of high-aspect-ratio silicon beams for stretchable silicon electronics

Stretchable mesh copper interconnect for batc fabrication of array-type microsystems

Mesh interconnects for silicone embedded stretchable silicon electronics

Cavity formation in a silicon cap wafer using aluminum etch-stop layer

RF-MEMS wafer-level packaging using through-wafer interconnect

RF-MEMS wafer-level packaging using through-wafer via technology

Hybrid wafer-level packaging scheme for RF-MEMS

Hybrid wafer-level packaging based on a capping substrate with cavities

Hybrid wafer-level packaging for RF MEMS applications

Hybrid wafer level packaging for RF MEMS applications

Through-substrate cavity fabrication for hybrid wafer-level packaging
A novel technique for fabrication of through-substrate cavities is proposed and demonstrated on single-crystalline silicon wafers intended for use as a capping substrate in wafer-level packaging. The through-substrate cavities are defined by non-continuous DRIE trenches around th ...

Fabrication of through-substrate cavities for hybrid wafer-level packaging

Flexible interconnects for deformable ultra-thin substrates

A calorimetric micro-sensor for methane detection

Chemoresistive gas sensor manufacturing using mixed technologies